EN
We manufacture a wide range of HDI PCB stack-ups, including 1+N+1, 2+N+2, 3+N+3, and any-layer HDI structures. Our engineering team can also recommend the most suitable stack-up based on your design requirements and application.
HDI PCB stands for High-Density Interconnect Printed Circuit Board, a specialized PCB technology designed to achieve higher wiring density, superior electrical performance, and compact product designs.
By utilizing laser-drilled microvias, blind and buried vias, fine-pitch components, and high-density routing, HDI PCBs enable advanced electronic products to become smaller, lighter, and more powerful while maintaining exceptional reliability.
Microvias
Laser-drilled microvias create reliable interconnections between PCB layers while minimizing signal transmission distances and improving electrical performance.
Blind and Buried Vias
Blind vias connect outer layers to inner layers, while buried vias connect internal layers without reaching the surface, maximizing routing space and design flexibility.
Fine Line and Space Technology
HDI PCBs support ultra-fine traces and spacing, often below 100 μm, allowing more circuits to fit within a limited board area.
High Layer Count Designs
HDI boards typically feature multiple layers, ranging from 8 to 20+ layers, to accommodate complex circuit architectures and high-speed signal requirements.
Via-in-Pad and Stacked Via Structures
Advanced via technologies optimize component placement, enhance signal integrity, and support high-density assembly for compact electronic devices.
High Circuit Density – Pack more connections in less space.
Improved Signal Integrity – Shorter traces reduce interference.
Compact Design – Optimize product size and weight.
Reliable Performance – Precision manufacturing ensures consistent results.
Smartphones, Tablets, Laptops
Wearable Devices (smartwatches, fitness devices)
Medical Equipment
Aerospace Electronics
Communication Systems
Suntech provides high-quality custom HDI PCB solutions with advanced manufacturing capabilities, strict quality control, and comprehensive engineering support. Our expertise in microvia technology, multilayer PCB fabrication, and precision assembly ensures reliable performance for demanding applications.
Upload your Gerber files and receive a manufacturing review within 24 hours.