Suntech provides end-to-end production from prototype to mass scale, combining precision, speed, and scalability. We operate in compliance with international quality standards including ISO 9001, ISO 14001, ISO 13485, and IATF 16949, ensuring every assembled PCB meets strict performance, reliability, and durability requirements.
Our production facility is equipped with high-speed, high-precision MYDATA and Yamaha placement systems, delivering accurate and stable component placement for both complex and high-volume assemblies.
For soldering, we utilize nitrogen-capable reflow ovens and selective soldering systems to ensure reliable solder joint quality for automotive, medical, industrial, and other high-reliability applications.
Our automated SMT production lines support both standard and high-density PCB assemblies.
• 6 Fully automated SMT production lines + 3 DIP Assembly lines + 2 Box Build and functional testing lines, providing flexible manufacturing capacity for both complex prototypes and large-scale production.
• Minimum component size: 01005 (0.4 × 0.2 mm)
• Fine-pitch BGA, CSP, and Micro BGA assembly down to 0.2 mm pitch
• Support for large connectors and odd-form components
• Daily placement capacity exceeding 3 million components
• Lead-free and RoHS-compliant manufacturing
Solder Paste Printing
Sweden MY500 solder paste jet printing system
Laser-etched ultra-fine stainless steel stencil (0.075–0.1 mm)
Type 5 ultra-fine solder paste
High-precision solder paste deposition control
SPI Inspection
3D solder paste inspection (SPI) for 100% coverage
Real-time measurement of solder volume and height
Early detection of insufficient or excessive solder
Prevention of bridging and misalignment defects
Reflow Soldering
12-zone precision temperature-controlled reflow ovens
Nitrogen atmosphere reflow capability
Optimized thermal profiles for fine-pitch and micro components
Effective reduction of tombstoning and component shifting
AOI Inspection
High-magnification 3D automated optical inspection
01005-level defect detection capability
Inspection of missing, misaligned, tombstoned, or reversed components
Full process traceability and defect recording
These systems ensure early defect detection, improved yield rates, and full production traceability.
In addition to SMT assembly, we provide complete through-hole and mixed-technology PCB assembly services, including:
Wave soldering
Selective soldering
Manual component insertion
BGA rework and repair
With over 20 years of experience, Suntech provides complete product-level manufacturing support, including full system assembly and box build services. This ensures customers can consolidate supply chain complexity and move from PCB fabrication to finished product under one roof.
Quality control is integrated throughout the entire manufacturing process.
100% AOI inspection
X-Ray inspection for BGA and hidden solder joints
ICT electrical testing
Full production traceability
Suntech provides quality SMT assembly and PTH assembly for clients around the globe for medical, aerospace, defense, industrial, automotive, communication, and consumer electronics.If you're looking for a reliable PCB assembly partner, we are ready to provide professional service. Our team will work with you to optimize your project’s cost, quality, and delivery.
📩 Contact us: [email protected]
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