| Items | Capabilities |
| Layer Count | 1-50L |
| Finished Board Thickness | 0.2mm-10.0mm |
| Max Panel Size | 610mm x 1200mm |
| Finished Copper Thickness | 0.5 OZ-12 OZ |
| Min Line Width/Space | 2.5mil/2.5mil |
| Min Finished Hole Size | 0.1mm |
| Max Aspect Ratio | 25:1 |
| Impedance Control Tolerance | +/-10% |
| Special Technologies | Blind & buried vias, POFV, edge plating, castellated holes, step mounting holes, controlled depth holes, metal based (core), step gold finger, back drill, partial hybrid pressing, bus bar, embedded coin, embedded ceramic etc. |
| Items | Capabilities |
| Assembly Type | SMT, BGA Assembly, Through Hole Assembly, Mixed Assembly |
| PCB Board Thickness | 0.2mm-8mm |
| Max Panel Size | 610mm x 460mm |
| Min Panel Size | 50mm x 50mm |
| SMT Component Size Range | 01005 (min), 55mm x 100mm, Max Height 15mm |
| SMT Component Pitch Range | 0.2 mm – 1.27 mm |
| SMT Repeat Accuracy | ±0.025mm |
| Inspection & Testing | Visual Inspection, In-Circuit Test (ICT), Flying Probe Test (FPT), Automated Optical Inspection (AOI), Automated X-Ray Inspection (AXI), Burn-In Testing |
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