Process Capability - Suntech Electronics pcb&pcba manufacturing

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PCB Process Capability

Description		Parameters	Remarks
Max layers number		30L
Min LW		3mil	Copper Thickness 0.5 OZ
Min LS		3mil	Copper Thickness 0.5 OZ
Min welding ring		Vias: 4mil	Ring is welded to the hold edge distance of the outermost ring
		Hole devices：5mil
Min hole diameter	Through hole	0.15mm
	laser via hole	0.1mm
Max thickness	Single and Double	0.2-6.0mm
	MLB	0.4-8.0mm
Max Aspect Ratio finished		13:1
Max Size	Single and Double	600 x 1200mm
	MLB	500 x 1200mm
Impedance Control Tolerance		土10%
Solder Mask coloer		Green, Blue, White, Black, Yellow, Red, Purple
Character		White、Yellow、Black
Surface coating		HASL、Electroless nickel/gold , Immersion Tin, Immersion Silver , OSP
Finished copper thickness	outer layer	7 oz
	inner layer	6 oz
Material		FR4, ROGERS, ARLON, TACONIC, NELCO, ISOLA, Al-base

Item			Volume	Prototype/Small Volume
PCB Specification of SMT Operation	Length x Width	Minimum	50x30	L<50 or W<30
	Length x Width	Maximum	450x350	800≥l>450 or 400≥W>350
	Thickness	Thinnest	0.8	T<0.8
	Thickness	Thickest	5	T>5
PCB Specification of DIP Operation	Length x Width	Minimum	50x30	L<50
	Length x Width	Maximum	500x300	1000≥l>500 or 450≥W>300
	Thickness	Thinnest	0.8	T<0.8
	Thickness	Thickest	5	T>5
Specification of SMT Component	Outline Size	Minimum Specifications	0603 (0201)	0602 (01005)
		Maximum Size	45x45	45x45<Size≤68x68 (45x150)
		Thickness of Component	25.4	T>25.4
	QFP/SOP/SOJ/IC Socket etc.	Minimum Distance of PIN	Pitch=0.4	Pitch=0.3
	CSP, BGA	Minimum Distance of BGA Ball	Pitch=0.5	0.3≤Pitch<0.5

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